AST- 601 Used & Refurbished Sputter System


Services Process Versatility

R&D, GaAs, Hybrid, IC, LSI, VLSI, Silicides, Solar Cell & Liquid Crystal

With the CVC 601 series Sputter System there are up to 8 process stations with up to 9 process modes available for your specified combination of sputter accessories.

  • Front and backside heat and preclean
  • Ion source clean
  • RF or DC magnetron sputtering
  • RF or DC diode sputtering
  • RF or DC triode sputtering
  • RF bias sputter and preclean
  • Co-Sputtering

Superior Film Quality

Film uniformity of +/-5% over the entire Rotostrate 7″ annulus is readily achieved with single axis, simple rotation. Dense films with high electrical conductivity and excellent ohmic contact are produced routinely, run after run. Grain size is easily controlled by adjustments of sputtering parameters.

Excellent Design for Clean Operation

Pinhole defects and particulate contamination are minimized with the sputter up configuration, the sputter system is designed to fit into a clean room or laminar flow hood to maximize process cleanliness. The internal chamber mechanisms are easy to lift out for rapid interchange with clean parts. It’s so easy, you can clean the system as often as your process requires and still maintain production schedules.

Basic System Overview

The CVC 601 is designed to be a totally flexible sputtering system with many modes and options. The CVC Magnetron gives you continuous coverage of complex surfaces with low pressure operation with precise control of film thickness. The films are of superior quality with excellent uniformity and step coverage. The CVC 601 design is user friendly for ease of Upgrades, Maintenance & Repair as required and Wafer handling changeover from various sized substrates is accomplished within seconds.

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